MASW-004102-12760 Datasheet, PDF (1/6 Pages) M/A-COM Technology Solutions, Inc. – HMIC™ Silicon PIN Diode Switch

MASW-004102-12760
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
Features
 Broad Bandwidth Specified up to 18 GHz
 Usable up to 26 GHz
 Integrated Bias Network
 Low Insertion Loss / High Isolation
 Rugged, Glass Encapsulated Construction
 Fully Monolithic
 RoHS Compliant* and 260°C Reflow Compatible
Rev. V4
Description
The MASW-004102-12760 device is a SP4T broadband
switch with integrated bias network utilizing M/A-COM
Technology Solutions HMIC^TM (Heterolithic Microwave
Integrated Circuit) process, US Patent 5,268,310. This
process allows the incorporation of silicon pedestals
that form series and shunt diodes or vias by imbedding
them in low loss, low dispersion glass. By using small
spacing between elements, this combination of silicon
and glass gives HMIC devices low loss and high isola-
tion performance with exceptional repeatability through
low millimeter frequencies. Large bond pads facilitate
the use of low inductance ribbon bonds, while gold
backside metallization allows for manual or automatic
chip bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag
solders or electrically conductive silver epoxy.
Applications
These high performance switches are suitable for use
in multi-band ECM, Radar, and instrumentation control
circuits where high isolation to insertion loss ratios are
required. With a standard +5V/-5V, TTL controlled PIN
diode driver, 80nS switching speeds can be achieved.
Yellow areas denote wire bond pads
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF Incident Power
Bias Current +25°C
Absolute Maximum
-65^oC to +125^oC
-65^oC to +150^oC
+175^oC
50V
+33dBm C.W.¹
±20mA
Note:
1. Maximum operating conditions for a
combination of RF power, D.C. bias and
temperature:
+33dBm CW @ 15mA (per diode) @+85°C
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.