MASW-002103-1363 Datasheet, PDF (1/8 Pages) M/A-COM Technology Solutions, Inc. – HMICTM Silicon PIN Diode SPDT Switch 50 MHz - 20 GHz

MASW-002103-1363
Silicon SPDT Surface Mount HMIC PIN Diode Switch
RoHS Compliant
Rev. V9
Features
• Operates 50 MHz to 20 GHz
• Usable up to 26 GHz
• Low Insertion Loss
• High Isolation
• Low Parasitic Capacitance and Inductance
• RoHS Compliant Surmount Package
• Rugged, Fully Monolithic
• Glass Encapsulated Construction
• Up to +38 dBm C.W. Power Handling @ +25°C
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Solderable
Description
The MASW-002103-1363 is a SPDT, surmount,
broadband, monolithic switch using two sets of
series and shunt connected PIN diodes. This device
is designed for use in broadband, low to moderate
signal, high performance, switch applications up to
20 GHz. It is a surface mountable switch configured
for optimized performance and offers a distinct
advantage over MMIC, beamlead and chip and wire
hybrid designs. Because the PIN diodes of the
MASW-002103-1363 are integrated into the chip
and kept within close proximity, the parasitics
typically associated with other designs that use
individual components are kept to a minimum.
To minimize the parasitics and achieve high
performance the MASW-002103-1363 is fabricated
using M/A-COM Technology Solutions’ patented
HMIC™ (Heterolithic Microwave Integrated Circuit)
process. This process allows the silicon pedestals,
which form the series and shunt diodes or vias, to be
imbeded in low loss, low dispersion glass. The
combination of low loss glass and using tight
spacing between elements results in an HMIC
device with low loss and high isolation through low
millimeter wave frequencies.
The topside is fully encapsulated with silicon nitride
and also has an additional layer of polymer for
scratch and impact protection. The protective
coating guards against damage to the junction and
the anode airbridges during handling and assembly.
On the backside of the chip gold metalized pads
have been added to produce a solderable surmount
device.
Functional Schematic
J3
J1
J2
Pin Configuration
Pin
Function
J1
RFC
J2
RF1
J3
RF2
Ordering Information
Part Number
Package
MASW-002103-13630G
50 piece gel pack
MASW-002103-13635P
500 piece reel
MASW-002103-13630P
3000 piece reel
MASW-002103-001SMB
Sample Test Board
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.