MASW-001150-13160_V5 Datasheet, PDF (1/9 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diode Switch Element

MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Features
 Specified Bandwidth: 45MHz—2.5GHz
 Useable 30MHz to 3.0GHz
 Low Loss <0.5dB
 High isolation >40dB
 High C.W. Incident Power, 50W at 500MHz
 High Input IP3, +66dBm @ 500MHz
 Unique Thermal Terminal for Series Diode
 Surface Mount Device (No Wire Bonds)
 Rugged Silicon-Glass Construction
 Silicon Nitride Passivation Protective Polymer
 Protective Polymer Scratch Protection
 RoHS Compliant
Description
A PIN diode series-shunt switch element with a unique
integrated thermal terminal for dissipating heat in the
series diode created by the DC and RF input power.
The thermal terminal allows for optimum heat dissipa-
tion by providing a direct thermal connection between
the series diode and the circuit heatsink while also
being electrically isolated. The chip is designed to pro-
vide a heat transfer conduit that does not interfere with
the PIN diode anode (input) and cathode (output) elec-
trical terminals, especially with respect to RF per-
formance. The chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process and
features silicon pedestals embedded in a low loss,
low dispersion glass for low leakage current. The top-
side is fully encapsulated with silicon nitride and has
an additional polymer layer to protect against damage
during handling and assembly.
Ordering Information ²
Part Number
Package
MASW-001150-13160W
WAFFLE PACK
MASW-001150-13160P
POCKET TAPE
2. Reference Application Note M513 for reel size information.
Absolute Maximum Ratings
Applications
Parameter
Forward Current
Absolute Maximum
100mA
This PIN diode series-shunt switch element is
particularly advantageous in high average power,
50W, switch applications from 30MHZ – 3GHz. The
backside RF, D.C., and thermal I/O ports allow for
Reverse Voltage
Operating Temperature
Storage Temperature
- 180V
-55°C to +125°C
-55°C to +150°C
direct solder re-flow, surface mount, attachment to a
Junction Temperature
+175°C
micro-strip circuit assembly. The thermal terminal
design provides the, power dissipating, series diode a
direct connection to the circuit thermal ground for
Dissipated RF & DC Power
RF C.W. Incident Power
500MHz, 4W
500MHz, 50W
unprecedented heat transfer. The thermal terminal
Mounting Temperature
+260°C for 30 seconds
port is electrically isolated from the I/O ports and can
be configured as either a reflective or an absorptive
switch.
ESD
ESD
Class 1A — HBM
Class M3 — MM
ESD
Class C3 — CDM
1 _{ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions}
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.