MASW-001150-1316 Datasheet, PDF (1/9 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diode Switch Element with Thermal Terminal

MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Features
♦ Specified Bandwidth: 30MHz—2.5GHz
♦ Useable to 3.0GHz
♦ Low Loss <0.5dB
♦ High isolation >40dB
♦ High C.W. Incident Power, 50W at 500MHz
♦ Unique Thermal Terminal for Series Diode
♦ Surface Mount Device (No Wire Bonds)
♦ Rugged Silicon-Glass Construction
♦ Silicon Nitride Passivation
♦ Protective Polymer Scratch Protection
♦ RoHS Compliant
Description
This device is a PIN diode series-shunt switch
element with a unique integrated thermal terminal for
dissipating heat in the series diode created by the
DC and RF input power. The thermal terminal allows
for optimum heat dissipation by providing a direct
thermal path from the series diode to circuit thermal
ground while also being electrically isolated. The chip
is designed to provide a heat transfer conduit that
does not interfere with the PIN diode anode (input)
and cathode (output) electrical terminals, especially
with respect to RF performance. The silicon-glass
PIN diode chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process.
This device features silicon pedestals embedded in a
low loss, low dispersion glass. Selective backside
metallization is applied producing a surface mount
device. The topside is fully encapsulated with silicon
nitride and has an additional polymer layer to protect
against damage during handling and assembly.
Ordering Information ²
Part Number
Package
MASW-001150-13160W
WAFFLE PACK
MASW-001150-13160P
POCKET TAPE
2. Reference Application Note M513 for reel size information.
Absolute Maximum Ratings
Applications
Parameter
Forward Current
Absolute Maximum
100mA
This PIN diode series-shunt switch element is
particularly advantageous in higher average power,
50W switch applications from 30MHZ – 3000GHz. In
addition, the backside RF, D.C., and thermal I/O
Reverse Voltage
Operating Temperature
Storage Temperature
- 180V
-55°C to +125°C
-55°C to +150°C
ports allow for direct solder re-flow attachments to
the micro-strip circuit for surface mount assembly. Of
particular interest, is the thermal terminal which
provides the power dissipating series diode a direct
Junction Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
+175°C
500MHz, 4W
500MHz, 50W
connection to the circuit thermal ground for
Mounting Temperature
+260°C for 30 seconds
unprecedented heat transfer. This thermal terminal is
electrically isolated from the other I/O ports. The chip
can be configured as either a reflective or an
ESD
ESD
Class 1A — HBM
Class M3 — MM
absorptive switch.
1
ESD
Class C3 — CDM
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] / Fax: [phone]
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: [phone] / Fax: [phone]
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
• Asia/Pacific Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.