MAIA-011002 Datasheet, PDF (1/14 Pages) M/A-COM Technology Solutions, Inc. – High Power Switch - LNA Module

MAIA-011002
High Power Switch - LNA Module
0.4 - 4.0 GHz
Rev. V2
Features
 2-Stage LNA and High Power Switch
 High RF Input Power:
120 W CW @ +85°C, 2.0 GHz
100 W CW @ +85°C, 2.7 GHz
 Noise Figure:
0.85 dB @ 2.0 GHz
1.0 dB @ 2.7 GHz
 Gain:
37 dB @ 2.0 GHz
34 dB @ 2.7 GHz
 OIP3: 36 dBm
 Lead-Free 5 mm 32-Lead HQFN
 Halogen-Free “Green” Mold Compound
 ROHS* Compliant
Description
The MAIA-011002 is a compact surface mount
module containing a PIN diode switch and two low
noise amplifiers assembled in a 5 mm 32 lead HQFN
plastic package. It was designed to be used at the
input of the receive chain of TDD cellular base
stations.
This module operates from 0.4 GHz to 4.0 GHz and
features high power handling, very low noise figure
and excellent linearity.
The connection between the output of LNA1 and the
input of LNA2 is made outside of the module,
making it possible for the user to add an attenuator
or a filter.
The MAIA-011002 is ideally suited for TD-LTE base
stations at 1.9, 2.3, 2.6 and 3.5 GHz.
Ordering Information^1,2
Part Number
Package
MAIA-011002-TR1000
1k Piece Reel
MAIA-011002-TR3000
3k Piece Reel
MAIA-011002-1SMB
2 - 3 GHz Sample Board
MAIA-011002-2SMB
3 - 4 GHz Sample Board
1. Reference Application Note M513 for reel size information.
2. All sample boards include 5 loose parts.
Functional Schematic
32 31 30 29 28 27 26 25
N/C 1
N/C 2
N/C 3
N/C 4
RFIN 5
N/C 6
N/C 7
N/C 8
24 RFOUT
LNA2
23 GND_LNA2
22 LNA2IN
21 GND
20 GND
Switch
LNA1
9 10 11 12 13 14 15 16
19 LNA1OUT
18 N/C
17 ^VB¹
Pin Configuration
1-4, 6-10,
12,16,18,25,32
5
11
13,14,20,21,
27,29,30
15
17
19
22
23
24
26
28
31
33
N/C³
RF_IN
R_X
GND
LNA1_IN
V_B1
LNA1_OUT
LNA2_IN
GND_LNA2
RF_OUT
V_B2
V_C
Load
Paddle
No Connection
RF Input / Bias
R_X Switch Output
RF Ground
LNA1 Input
LNA1 Bias
LNA1 Output / V_DD1
LNA2 Input
LNA2 Ground⁴
RF Output / V_DD2
LNA2 Bias
Switch Bias Control
T_X Switch Output
Ground⁵
3. MACOM recommends connecting unused package pins (N/C)
to ground.
4. Pin 23 must be connected to RF ground.
5. The exposed pad centered on the package bottom must be
connected to RF, DC and thermal ground.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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