MAIA-007851-000100 Datasheet, PDF (1/9 Pages) Tyco Electronics – Transmit Module for RFID 850 - 960 MHz

MAIA-007851-000100
Transmit Module for RFID
850-960 MHz
Rev. V1
Features
• Fully Integrated Buffer Amplifiers, Mixer, Power
Amplifier
• 0 to +7 dBm LO Drive
• +3.6V Nominal Supply Voltage
• +32.5 dBm Typical Output Power
• PA Matching Included in Device
• Lead-Free PQFN Package
• 100% Matte Tin Plating over Copper
• Halogen-Free “Green” Mold Compound
• 260°C Reflow Compatible
• RoHS Compliant
Description
M/A-COM's MAIA-007851 is a 850-960 MHz, high
efficiency, low cost transmit module designed for
RFID applications. This module includes buffer
amplifiers, a passive mixer, and a high efficiency
power amplifier, encapsulated in a low cost,
miniature surface mount PQFN 6 mm square, 28
lead plastic package. The dies utilize M/A-COM’s
unique HMIC silicon/glass and GaAs processes.
The product performance maximizes the advantages
provided by these processes with the realization of
low loss passive elements and efficient diode
technology which in turn provides excellent harmonic
suppression and output noise performance. In
addition, this module includes matching networks to
achieve 50 ohm input and output impedances,
therefore no external RF matching is required.
Applications
This transmit module is specifically targeted for the
RFID market in the United States, European, and
Japanese bands. This transmit module can also be
used for other applications in the 850-960 MHz
frequency range.
Ordering Information
Part Number
MAIA-007851-000100
MAIA-007851-0001TR
MAIA-007851-0001TB
Package
Bulk Packaging
1000 piece reel
Sample Test Board
Note: Reference Application Note M513 for reel size
information.
Functional Block Diagram
28 27 26 25 24 23 22
1
21
2
PA
20
Amp
3
19
RF
4
IF
18
LO
PA
5
Matching
17
Network
6
Buffer
16
Amp
7
15
8
9
10 11 12 13 14
Pin Configuration
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Function
VDD3 (VCC1)
VDD3 (VCS)
N/C
GND
VDD3 (VCC2)
PA OUT
PA OUT
GND
GND
VDD3 (VCC3)
VDD3 (VCC3)
GND
VDD1
GND
Pin No.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Function
LO_IN
GND
GND
IF_IN
GND
VDD2
GND
RF_OUT
GND
GND
GND
VCTRL
RF_IN
GND
The exposed pad centered on the package bottom must be
connected to RF and DC ground. (For PQFN Packages)
Pin 3 is an internal tie point and must not be connected to any
external circuitry.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
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• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.