MAGX-000035-05000P Datasheet, PDF (1/9 Pages) M/A-COM Technology Solutions, Inc. – GaN on SiC D-Mode Transistor Technology Common-Source Configuration

MAGX-000035-05000P
GaN Wideband 50 W Pulsed Transistor in Plastic Package
DC - 3.5 GHz
Rev. V3
Features
 GaN on SiC D-Mode Transistor Technology
 Unmatched, Ideal for Pulsed Applications
 50 V Typical Bias, Class AB
 Common-Source Configuration
 Thermally-Enhanced 3 x 6 mm 14-Lead DFN
 MTTF = 600 years (T_J < 200°C)
 Halogen-Free “Green” Mold Compound
 RoHS* Compliant and 260°C Reflow Compatible
 MSL-1
Description
The MAGX-000035-05000P is a GaN on SiC
unmatched power device offering the widest RF
frequency capability, most reliable high voltage
operation, lowest overall power transistor size, cost
and weight in a “TRUE SMT” plastic-packaging
technology.
Use of an internal stress buffer technology allows
reliable operation at junction temperatures up to
200°C. The small package size and excellent RF
performance make it an ideal replacement for costly
flanged or metal-backed module components.
Ordering Information^1,2
Part Number
Package
Functional Schematic
12 34 56 7
NC NC
G
NC NC
GG
15
DD
NC NC
D
NC NC
MAGX-000035-05000P
MAGX-000035-0500TP
Bulk Packaging
250 Piece Reel
14 13 12 11 10 9 8
Pin Configuration³
MAGX-000035-PB2PPR
Sample Board
Pin No. Function Pin No. Function
1. Reference Application Note M513 for reel size information.
2. When ordering sample evaluation boards, choose a standard
frequency range indicated on page 4 or specify a desired
custom range. Custom requests may increase lead times.
1
No Connection
8
No Connection
2
No Connection
9
No Connection
3
V_GG/RF_IN
10
V_DD/RF_OUT
4
V_GG/RF_IN
11
V_DD/RF_OUT
5
V_GG/RF_IN
12
V_DD/RF_OUT
6
No Connection
13
No Connection
* Restrictions on Hazardous Substances, European Union
Directive 2002/95/EC.
7
No Connection
14
No Connection
15
Paddle⁴
3. MACOM recommends connecting unused package pins to
ground.
4. The exposed pad centered on the package bottom must be
connected to RF and DC ground.
1
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