MADS-002545-1307 Datasheet, PDF (1/3 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip

MADS-002545-1307 Series
SURMOUNT^TM Schottky Diodes:
Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
M/A-COM Products
Rev. V3
Features
• Ultra Low Parasitic Capacitance and Inductance
• Surface Mountable in Microwave Circuits , No
Wire bonds Required
• Rugged HMIC Construction with Polyimide
Scratch Protection
• Reliable, Multilayer Metallization with a Diffusion
• Barrier, 100% Stabilization Bake (300 °C, 16 hours)
• Lower Susceptibility to ESD Damage
Description and Applications
The MADS-002545-1307 Series Surmount
Silicon Schottky Cross-Over Quad Diodes are fabri-
cated with the patented Heterolithic Microwave Inte-
grated Circuit (HMIC) process. HMIC circuits consist of
Silicon pedestals which form diodes or via conductors em-
bedded in a glass dielectric, which acts as the low disper-
sion, low loss, microstrip transmission medium. The combi-
nation of silicon and glass allows HMIC devices to have
excellent loss and power dissipation characteristics in a low
profile, reliable device.
These Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of a
beam lead device coupled with the superior mechanical per-
formance of a chip. The Surmount structure employs very low
resistance silicon vias to connect the Schottky contacts to the
metalized mounting pads on the bottom surface of the
chip. These devices are reliable, repeatable, and a
lower cost performance solution to conventional de-
vices. They have lower susceptibility to electrostatic
discharge than conventional beam lead Schottky di-
odes.
The multi-layer metallization employed in the fabrication of the
Surmount Schottky junctions includes a platinum diffu-
sion barrier, which permits all devices to be subjected to a 16-
hour non-operating stabilization bake at 300°C.
Top View
A
B
C
D
E
D
Side View
Case Style 1307
MADS-002545-1307
Equivalent Circuit
The “ 0202 ” outline allows for Surface Mount placement and
multi- functional polarity orientations. The MADS-002545-1307
Series is recommended for use in microwave circuits through
Ku band frequencies for lower power applications such as mix-
ers, sub-harmonic mixers, detectors and limiters. The HMIC
construction facilitates the direct replacement of more fragile
beam lead diodes with the corresponding Surmount diode,
which can be connected to a hard or soft substrate circuit with
solder.
Dim
A
B
C
D Sq.
E Sq.
Inches
Min.
Max.
0.023
0.025
0.023
0.025
0.004
0.008
0.007
0.009
0.007
0.009
Millimeters
Min.
Max.
0.575
0.625
0.575
0.625
0.102
0.203
0.175
0.225
0.175
0.225
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
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changes to the product(s) or information contained herein without notice.