MADP042005_15 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diodes

MADP-042XX5-13060 Series
SURMOUNT^TM PIN Diodes:
RoHS
Rev. V6
Features
 Surface Mount
 No Wirebonds Required
 Rugged Silicon-Glass Construction
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Low Parasitic Capacitance and Inductance
 High Average and Peak Power Handling
 RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Tech’s patented HMIC^TM proc-
ess. This device features two silicon pedestals embedded
in a low loss, low dispersion glass. The diode is formed on
the top of one pedestal and connections to the backside of
the device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
D
E
G
F
Applications
These packageless devices are suitable for moderate
incident power applications, ≤ 10W/C.W. or where the
peak power is ≤ 50W, pulse width is ≤ 1μS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings¹@ T_AMB = +25°C
(unless otherwise specified)
Parameter
Absolute Maximum
MADP-042…-13060 305 405 505 905
C.W. Incident Power dBm 40
44
43
35
Forward Current
Reverse Voltage
Operating Temperature
250 mA
-80 V
-55°C to +125°C
Storage Temperature
Junction Temperature
-55°C to +150°C
+175°C
Mounting Temperature
+280°C for 10 seconds
DIM
A
B
C
D
E
F
G
INCHES
MIN
0.040
0.021
0.004
0.013
0.011
0.013
MAX
0.042
0.023
0.008
0.015
0.013
0.015
0.019
0.021
MM
MIN
1.025
0.525
0.102
0.325
0.275
0.325
MAX
1.075
0.575
0.203
0.375
0.325
0.375
0.475
0.525
Notes:
1. Backside metal: 0.1 μM thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions ( A to G).
1. Exceeding these limits may cause permanent damage.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] / Fax: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.