MADP-0XX025-1314_15 Datasheet, PDF (1/5 Pages) M/A-COM Technology Solutions, Inc. – 25μm I-Region Length Devices

MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25μM PIN Diodes
RoHS Compliant
Features
 0603 Outline
 Surface Mount
 25µm I-Region Length Devices
 No Wirebonds Required
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Low Parasitic Capacitance and Inductance
 High Average and Peak Power Handling
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMIC^TM process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤50dBm/C.W. or where the peak
power is ≤75dBm, pulse width is 1μS, and duty cycle is
0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings¹ @ TA = +25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
Absolute Maximum
500 mA
- 135 V
-55°C to +125°C
-55 °C to +150°C
+175°C
50dBm
+280°C for 30 seconds
1) Exceeding these limits may cause permanent damage
1
Case Style ODS 1314
Rev. V5
Chip Dimensions
DIM
INCHES
MM
Min
Max
Min
Max
A
0.060 0.062 1.525 1.575
B
0.031 0.032 0.775 0.825
C
0.004 0.008 0.102 0.203
D
0.019 0.021 0.475 0.525
E
0.019 0.021 0.475 0.525
F
0.019 0.021 0.475 0.525
G
0.029 0.031 0.725 0.775
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support