MADP-0XX025-1314 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT™ 25μM PIN Diodes

MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
Case Style ODS 1314
Rev. V5
Features
♦ 0603 Outline
♦ Surface Mount
♦ 25µm I-Region Length Devices
♦ No Wirebonds Required
♦ Silicon Nitride Passivation
♦ Polymer Scratch Protection
♦ Low Parasitic Capacitance and Inductance
♦ High Average and Peak Power Handling
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMIC^TM process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤50dBm/C.W. or where the peak
power is ≤75dBm, pulse width is 1µS, and duty cycle is
0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Chip Dimensions
DIM
INCHES
MM
Min
Max
Min
Max
A
0.060 0.062 1.525 1.575
Absolute Maximum Ratings¹ @ TA = +25°C
(unless otherwise specified)
B
0.031 0.032 0.775 0.825
C
0.004 0.008 0.102 0.203
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Peak Incident Power (dBm)
Mounting Temperature
Absolute Maximum
500 mA
- 135 V
-55°C to +125°C
-55 °C to +150°C
+175°C
+44dBm MADP-017025
+47dBM MADP-030025
+50 dBm, 10µS, 1% duty
+280°C for 30 seconds
D
0.019 0.021 0.475 0.525
E
0.019 0.021 0.475 0.525
F
0.019 0.021 0.475 0.525
G
0.029 0.031 0.725 0.775
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
1 ^{1) Exceeding these limits may cause permanent damage}
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions _{• North America Tel: [phone] • Europe Tel: [phone]}
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.