MADP-064908-131000_15 Datasheet, PDF (1/7 Pages) M/A-COM Technology Solutions, Inc. – Surmount PIN Chip

MADP-064908-131000
Unconnected Double Tee
Surmount ^TM PIN Chip
RoHS Compliant
Rev. V3
Features
♦ No Wire Bonds Required
♦ Rugged Silicon-Glass Construction
♦ Silicon Nitride Passivation
♦ Polymer Scratch Protection
♦ Ultra-Low Parasitic Capacitance and Inductance
♦ Higher RF C.W. Power Handling
♦ Better Performance than Packaged Devices
Description and Applications
This device is a silicon glass PIN diode chip fabricated with
M/A-COM Tech Solutions patented HMIC process.
This 80μm I-region length device features six silicon
pedestals embedded in a low loss, low dispersion
glass. The diodes are formed on the top of a ped-
estal and connections to the backside of the device
are facilitated by making the pedestal sidewalls elec-
trically conductive. Selective backside metallization is ap-
plied producing a surface mount device. The topside
is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch protection.
These protective coatings prevent damage to the
junction and the anode air-bridge during handling
and assembly. The vertical silicon diode topology
provides for a highly efficient heat transfer medium.
These surface mount devices are suitable for usage
in higher (3W avg.) incident power switches. Small
parasitic inductance and excellent RC constant
make these devices ideal for absorptive SPST, re-
flective SP2T switches, and attenuator circuits,
where higher P1db and power handling values are
required.
Absolute Maximum Ratings¹
@ T_AMB = +25°C (unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
250mA
Reverse Voltage
Operating Temperature
Storage Temperature
–100V
-55°C to +125°C
-55°C to +150°C
Junction Temperature
+175°C
C.W. Incident Power
+35dBm
Mounting Temperature
+300°C for 10 seconds
Case Style - ODS-1310
Dim
Inches
Millimeters
Min.
Max.
Min.
Max.
A
0.060
0.062
1.524
1.575
B
0.036
0.038
0.914
0.965
C
0.004
0.008
0.102
0.203
D
0.011
0.012
0.279
0.305
1. Operation of this device above any one of these parameters may
cause permanent damage.
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaran-
teed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.