MADP-042XX8 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNTTM 8
M PIN Diodes

MADP-042XX8-13060 Series
SURMOUNT^TM 8µM PIN Diodes
RoHS Compliant
Features
• Surface Mount
• No Wirebonds Required
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Low Parasitic Capacitance and Inductance
• High Average and Peak Power Handling
• RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions’ patented
HMIC^TM process. This device features two silicon
pedestals embedded in a low loss, low dispersion glass.
The diode is formed on the top of one pedestal and
connections to the backside of the device are facilitated by
making the pedestal sidewalls electrically conductive.
Selective backside metallization is applied producing a
surface mount device. This vertical topology provides for
exceptional heat transfer. The topside is fully
encapsulated with silicon nitride and has an additional
polymer layer for scratch and impact protection. These
protective coatings prevent damage to the junction and the
anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for moderate
incident power applications, ≤ 10W/C.W. or where the
peak power is ≤ 52W, pulse width is ≤ 1µS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings¹@ T_AMB = +25°C
(unless otherwise specified)
Parameter
Absolute Maximum
MADP-042 -13060 308 408 508 908
C.W. Incident Power dBm +42
+44
+43
+39
Forward Current
250 mA
Reverse Voltage
-100 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
Mounting Temperature
+280°C for 10 seconds
1. Exceeding these limits may cause permanent damage.
Rev. V2
D
E
G
F
DIM
A
B
C
D
E
F
G
INCHES
MIN.
MAX.
0.040
0.042
0.021
0.023
0.004
0.008
0.013
0.015
0.011
0.013
0.013
0.015
0.019
0.021
MM
MIN.
MAX.
1.025
1.075
0.525
0.575
0.102
0.203
0.325
0.375
0.275
0.325
0.325
0.375
0.475
0.525
Notes:
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions ( A to G).
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.