MADP-017015-1314_15 Datasheet, PDF (1/5 Pages) M/A-COM Technology Solutions, Inc. – 15μm I-Region Length Devices

MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Features
 0603 Outline
 Surface Mount
 15µm I-Region Length Devices
 No Wirebonds Required
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Low Parasitic Capacitance and Inductance
 High Average and Peak Power Handling
Rev. V6
Case Style ODS 1314
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM Technology Solutions patented
HMIC^TM process. This device features two silicon pedes-
tals embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and connec-
tions to the backside of the device are facilitated by mak-
ing the pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This vertical topology provides for excep-
tional heat transfer. The topside is fully encapsulated
with silicon nitride and has an additional polymer layer for
scratch and impact protection. These protective coatings
prevent damage to the junction and the anode air-bridge
during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤ 50dBm/C.W. or where the
peak power is ≤ 75dBm, pulse width is ≤ 1μS, and duty
cycle is ≤ 0.01%. Their low parasitic inductance, 0.4 nH,
and excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Absolute Maximum Ratings¹ @T_AMB = +25°C
(unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
500 mA
Reverse Voltage
- 115 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55 °C to +150°C
Junction Temperature
+175°C
C.W. Incident Power
50dBm
Mounting Temperature
+280°C for 30 seconds
1) Exceeding these limits may cause in permanent damage
Chip Dimensions
DIM
INCHES
MM
Min
Max
Min
Max
A
0.060 0.062 1.525 1.575
B
0.031 0.032 0.775 0.825
C 0.004 0.008 0.102 0.203
D 0.019 0.021 0.475 0.525
E
0.019 0.021 0.475 0.525
F
0.019 0.021 0.475 0.525
G 0.029 0.031 0.725 0.775
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
1
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