MADP-017015-1314 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT™ 15μM PIN Diodes RoHS Compliant

MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15µM PIN Diodes
RoHS Compliant
Features
♦ 0603 Outline
♦ Surface Mount
♦ 15µm I-Region Length Devices
♦ No Wirebonds Required
♦ Silicon Nitride Passivation
♦ Polymer Scratch Protection
♦ Low Parasitic Capacitance and Inductance
♦ High Average and Peak Power Handling
Case Style ODS 1314
Rev. V5
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMIC^TM process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤ 50dBm/C.W. or where the
peak power is ≤ 75dBm, pulse width is ≤ 1µS, and duty
cycle is ≤ 0.01%. Their low parasitic inductance, 0.4 nH,
and excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts.
Chip Dimensions
DIM
INCHES
MM
Min
Max
Min
Max
A
0.060 0.062 1.525 1.575
Absolute Maximum Ratings¹ @T_AMB = +25°C
(unless otherwise specified)
Parameter
Forward Current
Absolute Maximum
500 mA
Reverse Voltage
- 115 V
Operating Temperature
-55°C to +125°C
B
0.031 0.032 0.775 0.825
C
0.004 0.008 0.102 0.203
D
0.019 0.021 0.475 0.525
E
0.019 0.021 0.475 0.525
F
0.019 0.021 0.475 0.525
G
0.029 0.031 0.725 0.775
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
-55 °C to +150°C
+175°C
50dBm
+280°C for 30 seconds
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
1 ^{1) Exceeding these limits may cause in permanent damage}
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] / Fax: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
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Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.