MADP-011034-10720T_15 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – Non-Magnetic MELF PIN Diode

MADP-011034-10720T
Non-Magnetic MELF PIN Diode
Features
♦ Non-Magnetic Package for MRI Applications
♦ Rectangular MELF Ceramic Package
♦ Hermetically Sealed
♦ RoHS Compliant
Rev V2
Package Style 1072
Description
The MADP-011034-10720T is a surface mount PIN
diode in a non-magnetic Metal Electrode Leadless
Faced (MELF) package. The MADP-011034-10720T
is manufactured using M/A-COM Technology
Solutions time proven HIPAX technology. The result
is a low inductance ceramic package with no ribbons
or wires. The package utilizes a unique non-magnetic
plating process that provides for a hermetically sealed
component that has extremely low electromagnetic
permeability. Incorporated in the package is a glass
passivated CERMA chip that is full face bonded on
the cathode and anode which maximizes the surface
contact area to minimize the electrical and thermal
resistances. The chip and package have been
comprehensively characterized both electrically and
mechanically to ensure repeatable and predictable
performance.
Application
The MADP-011034-10720T is designed for circuit
protection and the tuning of RF coil designs in MRI
applications. When connected in an anti-parallel
configuration these PIN diodes provide excellent
protection from long RF pulses and transient voltage
spikes.
Absolute Maximum Ratings^1,2,3@ 25°C
Parameter
Reverse DC & AC Voltage ^1,2
D.C. Forward Current^1,2
Peak A.C. Forward Surge
Current ( 8.3 mS Single
Half Sine Wave )^1,2
C.W. Power Dissipation ^1,2,3
Operating Temperature^1,2
Storage Temperature^1,2
Mounting Temperature^1,2
Absolute
Maximum
|-150 V|
0.5 A
2.5 A
6.0 W
-65°C to +150°C
-65°C to +175°C
+260°C for 30 s
Designed for Automated Assembly
This easy to use package design makes automatic
pick and place, indexing and assembly, extremely
easy. The parallel flat surfaces are well suited for
most key jaw or vacuum pick-up techniques. All of the
solderable surfaces are tin plated and compatible with
industry standard reflow and vapor phase soldering
processes.
1. Exceeding these limits may cause permanent damage
2. Values will de-rate over temperature.
3. Infinite Heat Sink, de-rate to 0W @ +175 °C ,
by –40mW/°C from 25°C to +175 °C
RoHS
The MADP-011034-10720T is fully RoHS compliant
meaning that it contains less than the maximum
allowable concentration of 0.1% by weight for lead,
PBB, PBDE, and 0.01% of cadmium and hexavalent
chromium at raw homogeneous materials level.
There is less than 100ppm of mercury and no
mercury was intentionally added to the component.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
• North America Tel: [phone] / Fax: [phone]
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macom.com for additional data sheets and product information.
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.