MADP-011029 Datasheet, PDF (1/9 Pages) M/A-COM Technology Solutions, Inc. – 3 Terminal LPF Broadband Shunt Structure

MADP-011029-14150
High Power PIN Diode
50 MHz - 12 GHz
Features
 3 Terminal LPF Broadband Shunt Structure
 50 MHz - 12 GHz Broadband Frequency
 >100 W Peak Power Handling
 < 0.1 dB Shunt Insertion Loss
 > 25 dB Shunt Isolation
 < 20°C/W Thermal Resistance
 Lead-Free 1.5 x 1.2 mm 6-lead TDFN Package
 RoHS* Compliant and 260°C Reflow Compatible
Description
The MADP-011029 is a lead-free 1.5 x 1.2 mm
TDFN surface mount plastic package that provides
both low and high signal frequency operation from
50 MHz to 12 GHz. The higher breakdown voltage
and lower thermal resistance of the PIN diode
provides peak power handling in excess of 100 W.
This device is ideally suitable for usage in higher
incident power switches, phase shifters, attenuators,
and limiter microwave circuits over a broad
frequency where higher performance surface mount
diode assemblies are required.
Ordering Information^1,2
Part Number
Package
MADP-011029-14150T
3000 piece reel
MADP-011029-000SMB
Sample board
1. Reference Application Note M513 for reel size information.
2. All RF Sample boards include 5 loose parts.
Functional Schematic
RF_IN
1
GND 2
GND ₃
7
Rev. V3
6 ^RFOUT
5 GND
4 GND
Pin Configuration³
Pin No.
1
2
3
4
5
6
7
Pin Name
RF_IN
GND
GND
GND
GND
RF_OUT
Paddle⁴
Description
RF Input
Ground
Ground
Ground
Ground
RF Output
Ground
3. MACOM recommends connecting unused package pins to
ground.
4. The exposed pad centered on the package bottom must be
connected to RF, DC, and thermal ground.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
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