MADP-000907-14020X Datasheet, PDF (1/5 Pages) M/A-COM Technology Solutions, Inc. – Solderable AlGaAs Flip Chip PIN

MADP-000907-14020x
Solderable AlGaAs Flip Chip PIN
Features
 Low Series Resistance
 Ultra Low Capacitance
 Millimeter Wave Switching & Cutoff Frequency
 Useable up to 70 GHz
 2 Nanosecond Switching Speed
 Can be Driven by a Buffered TTL
 Silicon Nitride Passivation
 Polyimide Scratch Protection
 RoHS Compliant
Description
The MADP-000907-14020 is a solderable, flip-chip
Aluminum Gallium Arsenide (AlGaAs) PIN diode. It
is fabricated with MOCVD grown epitaxy using a
process and design that optimizes device to device
uniformity and produces extremely low parasitics.
The diode exhibits an exceptionally low RC product
(0.1 ps) and a 2-3 ns switching speed. The chips are
fully passivated with silicon nitride and have an
added BCB polymer layer for scratch protection. The
BCB protective coating prevents damage to the
diode junction area and anode air-bridge during
handling and assembly.
The ultra low capacitance of the MADP-000907-
14020 allows for operation at millimeter wave
frequencies for RF switches and phase shifter
applications. The diode is designed to be used in
pulsed or CW applications, where single digit ns
switching speed is required. The low capacitance of
the PIN diode makes it ideal for use in many
microwave multi-throw switch assemblies, where the
series capacitance of each “off” port adversely loads
the input and affects VSWR.
Ordering Information
Part Number
MADP-000907-14020W
MADP-000907-14020P
Package
Waffle Pack
Tape and Reel
Rev. V7
1. Backside metal: 0.2 µm gold over 4 µm nickel.
2. Yellow hatched areas indicate backside ohmic gold contacts.
Outline Dimension
INCHES
DIM
Min.
Max.
A
0.026
0.027
B
0.014
0.015
C
0.007
0.008
D
0.004
0.005
E
0.007
0.0073
F
0.018
0.019
MM
Min.
Max.
0.660
0.686
0.343
0.368
0.165
0.191
0.109
0.135
0.173
0.185
0.462
0.488
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
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