MADP-000208 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT TM 8m PIN Diode Pair

MADP-000208-13180W
SURMOUNT ^TM 8m PIN Diode Pair
RoHS Compliant
Features
 Surface Mount Device
 8 µm I-Region Length Devices
 Two PIN diodes in Flexible Configuration
 No Wire bonds Required
 Rugged Silicon-Glass Construction
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Low Parasitic Capacitance and Inductance
Description
The MADP-000208-13180W is a pair of silicon
glass PIN diodes incorporated onto one chip and
is fabricated using M/A-COM Technology Solutions
patented HMIC^TM process. The device features
three silicon pedestals embedded in low loss, low
dispersion glass (k=4.1, Tanδ=0.002). The diodes
are formed on the top of pedestals and connections
to the backside of the device are made via elec-
trically conductive sidewalls. Selective backside
metallization is applied to produce a surface mount
device. This vertical topology provides for excep-
tional heat transfer and also allows the topside to be
fully encapsulated with silicon nitride. An additional
polymer layer is also added to provide scratch and
impact protection. These protective coatings pre-
vent damage to the junction and the anode air-
bridge during handling and assembly.
Applications
The MADP-000208-13180W packageless devices
are suitable for usage in high incident power, 44.8
dBm C.W at 2 GHz., series, shunt, or series-shunt
switches. The low parasitic inductance, < 0.12
nH, and excellent RC constant, make these de-
vices an attractive alternative for high frequency
switch elements when compared to their plastic
device counterparts.
Ordering Information
Part Number
MADP-000208-13180W
Package
200 pieces per tray
Outline Drawing
M/A-COM Products
Rev. V2
Bottom Side Contacts (Circuit Side)
Dim.
A
B
C
D
E
F
G
Inches
min
max
0.0440 0.0460
0.0140 0.0160
0.0045 0.0055
0.0115 0.0125
0.0055 0.0065
0.0055 0.0065
0.0115 0.0125
Millimeter
min
max
1.118
1.168
0.355
0.406
0.114
0.140
0.292
0.318
0.140
0.165
0.140
0.165
0.292
0.318
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.