MADP-000208-13180W Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT TM 8μm PIN Diode Pair RoHS Compliant

MADP-000208-13180W
SURMOUNT ^TM 8μm PIN Diode Pair
RoHS Compliant
Features
• Surface Mount Device
• 8 µm I-Region Length Devices
• Two PIN diodes in Flexible Configuration
• No Wire bonds Required
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Low Parasitic Capacitance and Inductance
Description
The MADP-000208-13180W is a pair of silicon
glass PIN diodes incorporated onto one chip and
is fabricated using M/A-COM’s patented HMIC^TM
process. The device features three silicon pedestals
embedded in low loss, low dispersion glass (k=4.1,
Tanδ=0.002). The diodes are formed on the top of
pedestals and connections to the backside of the
device are made via electrically conductive
sidewalls. Selective backside metallization is applied
to produce a surface mount device. This vertical
topology provides for exceptional heat transfer and
also allows the topside to be fully encapsulated with
silicon nitride. An additional polymer layer is also
added to provide scratch and impact protection.
These protective coatings prevent damage to the
junction and the anode air-bridge during handling
and assembly.
Applications
The MADP-000208-13180W packageless devices
are suitable for usage in high incident power, 44.8
dBm C.W at 2 GHz., series, shunt, or series-shunt
switches. The low parasitic inductance, < 0.12 nH,
and excellent RC constant, make these devices an
attractive alternative for high frequency switch
elements when compared to their plastic device
counterparts.
Ordering Information
Part Number
MADP-000208-13180W
Package
390 pieces per tray
Outline Drawing
Rev. V1
Bottom Side Contacts (Circuit Side)
Dim.
A
B
C
D
E
F
G
Inches
min
max
0.0440 0.0460
0.0140 0.0160
0.0045 0.0055
0.0115 0.0125
0.0055 0.0065
0.0055 0.0065
0.0115 0.0125
Millimeter
min
max
1.118
1.168
0.355
0.406
0.114
0.140
0.292
0.318
0.140
0.165
0.140
0.165
0.292
0.318
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] / Fax: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.