MA4SPS552 Datasheet, PDF (1/6 Pages) Tyco Electronics – Surface Mount Monolithic PIN Diode Chip

MA4SPS552
SURMOUNTTM PIN Diode
RoHS Compliant
Features
Surface Mount Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Ultra-Low Parasitic Capacitance and Inductance
Higher Power Handling ( Efficient Heat sinking )
Description
This device is a silicon-glass PIN diode chip fabricated
with M/A-COM Technology Solutions patented HMIC
process. This device features two silicon pedestals em-
bedded in a low loss glass. The diode is formed on the
top of one pedestal and connections to the backside of
the device are facilitated by making the pedestal side-
walls conductive. Selective backside metalization is
applied producing a surface mount device. The topside
is fully encapsulated with silicon nitride and has an addi-
tional polymer layer for scratch protection. These pro-
tective coatings prevent damage to the junction and the
anode air-bridge during handling and assembly.
Absolute Maximum Ratings
TA = +25°C (unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
100 mA
Reverse Voltage
-200 V
Operating Temperature
-65°C to +150°C
Storage Temperature
Junction Temperature
-65°C to +150°C
+175°C
Dissipated RF & DC Power
1W
Mounting Temperature
+235°C for 10 seconds
Applications
These packageless devices are suitable for usage in
Moderate Incident Power ( 5 W C.W. ) or Higher Incident
Peak Power ( 200 W, 1 uS, 0.001 Duty ) Series, Shunt, or
Series-Shunt Switches. Small Parasitic Inductance, 0.7
nH, and Excellent RC Constant, 0.20 pS, make the de-
vices ideal for TR Switch and Accessory Switch Circuits,
where higher P1db and IP3 values are required.
These diodes can also be used in π, T, Tapered Resis-
tance, and Switched-Pad Attenuator Control Circuits for
50Ω or 75Ω systems
1
Rev. V1
A
B
C
D
E
F
G
dim.
in
min.
max.
mm
min.
max.
A 0.0207 0.0226 0.525 0.575
B 0.0108 0.0128 0.275 0.325
C 0.0040 0.0080 0.102 0.203
D 0.0069 0.0089 0.175 0.225
E 0.0018 0.0037 0.045 0.095
F 0.0061 0.0081 0.155 0.205
G 0.0069 0.0089 0.175 0.225
1. Backside metal: 0.1 micron thk.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaran-
teed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifica-
tions are typical. Mechanical outline has been fixed. Engineering samples and/or test data
may be available. Commitment to produce in volume is not guaranteed.
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product(s) or information contained herein without notice.