MA4SPS302_15 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT PIN Diode

MA4SPS302
SURMOUNT^TM PIN Diode
RoHS Compliant
Features
 Surface Mount
 No Wire Bonding Required
 Rugged Silicon-Glass Construction
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Low Parasitic Capacitance and Inductance
 High Average and Peak Power Handling
 RoHS Compliant
MA4SPS302
Rev. V4
Description
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM Tech’s patented HMIC^TM
process. This device features two silicon pedestals
embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and
connections to the backside of the device are
facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical conic topology provides for
exceptional heat transfer from the active area. The
topside is fully encapsulated with silicon nitride and
has an additional polymer layer for scratch and
impact protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
Absolute Maximum Ratings
T_AMB = 25°C (unless otherwise specified)
Parameter
Forward Current
Absolute Maximum
600mA
Reverse Voltage
| -100V |
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power
( RF & DC )
Mounting Temperature
-55°C to +125°C
-55 °C to +150°C
+175°C
800mW
+260°C for 30 seconds
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backside ohmic gold
INCHES
MM
DIM
Min. Max. Min. Max.
A 0.052 0.056 1.321 1.422
B 0.020 0.024 0.508 0.610
C 0.004 0.006 0.102 0.152
D 0.018 0.020 0.457 0.508
E 0.014 0.016 0.356 0.406
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.