MA4P7470F-1072T Datasheet, PDF (1/7 Pages) Tyco Electronics – Non Magnetic SMQ HIPAX PIN Diode

MA4P7470F-1072T
2000 Volt & 3000 Volt PIN Diodes
MA4PK2000, MA4PK3000
Features
• Non-Magnetic Package Suitable for MRI
Applications
• Rectangular MELF SMQ Ceramic Package
• Hermetically Sealed
• Low Rs for Lower Series Loss
• Long τ_L for Low Intermodulation Distortion
• Low Cj for High Series Isolation
• High Average Incident Power Handling
Capability
Description and Applications
The MA4P7470F-1072T is a surface mountable
PIN diode in a non-magnetic Metal Electrode
Leadless Faced (MELF) package.The device
incorporates M/A-COM’s time proven HIPAX
technology to produce a low inductance ceramic
package with no ribbons or whisker wires. The
package utilizes M/A-COM’s new non- magnetic
plating process to provide an extremely low
permeability, hermetically sealed package.
Incorporated in the package is a passivated PIN
diode that is full face bonded on both the
cathode and anode of the chip to maximize
surface area for low electrical and thermal
resistance. The MA4P7470F-1072T has been
comprehensively characterized both electrically
and mechanically to ensure repeatable and
predictable performance. This MA4P7470F-
1072T non-magnetic device is similar in electri-
cal performance to the MA4P7417F-1072T mag-
netic part number.
The diode is well suited for use in low loss, low
distortion, and high power switching circuits
applicable for high magnetic field environments
from HF through UHF frequencies. The lower
thermal
resistance of this device provides excellent
higher average performance at RF power inci-
dent levels up to 200 watts CW. This device is
designed to meet the most rigorous electrical
and mechanical
requirements of MRI testing environments.
Rev. V2
Designed for Automated Assembly
These SMQ PIN diodes are designed for high
volume tape and reel assembly. The rectangular
package design provides for highly efficient
automatic pick and place assembly techniques. The
parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solderable surfaces
are tin plated and compatible with reflow and vapor
phase soldering methods.
Absolute Maximum Ratings¹ @ +25°C
Parameter
Operating Temperature
Storage Temperature
Diode Junction Temperature
Diode Mounting Temperature
RF C.W. Incident Power
Forward D.C. Current
Reverse D.C. Voltage @ -10 uA
Absolute Maximum
-65°C to +125°C
-65°C to +150°C
+175°C Continuous
+265 °C for 10 seconds
+ 53dBm C.W.
+ 150mA
- 800V
1. Exceeding these limits may cause permanent damage.
1
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.