MA4P7461F-1072T Datasheet, PDF (1/5 Pages) Tyco Electronics – Non Magnetic SMQ HIPAX PIN Diode

MA4P7461F-1072T
Packaged PIN Diodes
RoHs Compliant
Rev. V3
Features
♦ Non-Magnetic Package Suitable for MRI
Applications
♦ Rectangular MELF SMQ Ceramic Package
♦ Hermetically Sealed
♦ Lower Rs for Lower Series Loss
♦ Longer τ_L for Lower Intermodulation Distortion
♦ Lower Cj for Higher Series Isolation
♦ Higher Average Incident Power Handling
Capability
Description and Applications
The MA4P7461F-1072T is a surface mountable PIN
diode in a Non-Magnetic (patent pending) Metal
Electrode Leadless Faced (MELF) package. The
device incorporates M/A-COM’s proven HIPAX
technology to produce a low inductance ceramic
package with no ribbons or whisker wires. The
package utilizes M/A-COM’s new non-magnetic
plating process to provide an extremely low
permeability, hermetically sealed package.
Incorporated in the package is a passivated PIN
diode that is full face bonded on both the cathode
and anode of the chip to maximize surface area for
lower electrical and thermal resistance. The
MA4P7461F-1072T has been comprehensively
characterized both electrically and mechanically to
ensure repeatable and predictable performance.
This MA4P7461F-1072T non-magnetic device is
similar in electrical performance to the
MA4P1250-1072T and the MA4P7101F-1072T
magnetic part numbers.
The diodes are well suited for use in low loss, low
distortion, and high power switching circuits
applicable for high magnetic field environments from
HF through UHF frequencies. The lower thermal
resistance of this device provides excellent higher
average performance at RF power incident levels up
to 100 watts CW. This device is designed to meet
the most rigorous electrical and mechanical
requirements of MRI testing environments.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high
volume tape and reel assembly. The rectangular
package design provides for highly efficient
automatic pick and place assembly techniques. The
parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solder able surfaces are
tin plated and compatible with reflow and vapor phase
soldering methods.
Absolute Maximum Ratings¹ @ 25°C
Parameter
Absolute Maximum
Operating Temperature
-65°C to +125°C
Storage Temperature
-65°C to +150°C
Diode Junction Temperature +175°C Continuous
Diode Mounting Temperature +260°C² for 30 secs.
RF C.W. Incident Power
+ 50 dBm C.W.
Forward Current
+150mA
Reverse Voltage @ -10uA
l -150V l
Note:
1) Exceeding these limits may cause permanent damage.
2) For more detailed mounting information, see application
note M538 on the Tyco Electronics website located at
www.macom.com/Application%20Notes/pdf/M538.pdf
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.