MA4P7446F-1091T Datasheet, PDF (1/7 Pages) Tyco Electronics – Non Magnetic SMQ HIPAX PIN Diode

MA4P7446F-1091T
Non Magnetic SMQ HIPAX PIN Diode
RoHS Compliant
Features
♦ Non-Magnetic Package Suitable for MRI
Applications
♦ Rectangular MELF SMQ Ceramic Package
♦ Hermetically Sealed
♦ Low Rs for Low Series Loss
♦ Long τ_L for Lower Intermodulation Distortion
♦ Low C_j for High Series Isolation
♦ High Average Incident Power Handling
Rev. V3
Description
The MA4P7446F-1091T is a surface mountable
PIN diode in a non-magnetic, Metal Electrode
Leadless Faced (MELF) package. The device
incorporates M/A-COM’s time proven HIPAX
technology to produce a low inductance ceramic
package with no ribbons or whisker wires.
Incorporated in the package is a hard glass
passivated, CERMACHIP™ PIN diode that is full
face bonded on both the cathode and anode to
maximize surface area for the lowest electrical
and thermal resistance. The package utilizes a
non-magnetic plating process that provides for a
package with extremely low permeability. The
MA4P7446F-1091T has been comprehensively
characterized both electrically and mechanically
to ensure repeatable and predictable
performance. The non-magnetic
MA4P7446F-1091T is the electrical equivalent
of its magnetic counterparts the MA4P4002F-
1091T and MA4P4006F-1091T .
Applications
The diodes are well suited for use in low loss,
low distortion, and high power switching circuits
applicable for high magnetic field environments
from HF through UHF frequencies. The low
thermal resistance of this device provides
excellent performance at high RF power incident
levels, up to 500 watts CW. This device is
designed to meet the most rigorous electrical
and mechanical requirements of MRI environ-
ments.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high
volume tape and reel assembly. The rectangular
package design provides for highly efficient
automatic pick and place assembly techniques. The
parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solder able surfaces
are tin plated and compatible with reflow and vapor
phase soldering methods.
Absolute Maximum Ratings¹ @ 25°C
Parameter
Absolute Maximum
Operating Temperature
-65°C to +125°C
Storage Temperature
-65°C to +150°C
Diode Junction Temperature +175 °C Continuous
Diode Mounting Temperature +235°C for 10 seconds
RF C.W. Incident Power
+ 57dBm C.W.
Forward D.C. Current
+500 mA
Reverse D.C. Voltage @ -10 uA
- 650V
1. Exceeding these limits may cause permanent damage.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.