M538 Datasheet, PDF (1/8 Pages) M/A-COM Technology Solutions, Inc. – Surface Mounting Instructions

Application Note
M538
Surface Mounting Instructions
Rev. V6
Footprint Guidelines
Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to
ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the package will self-align when subjected to a solder reflow process and will also allow for just enough excess
surface area for adequate solder filleting. The following recommended footprints are suggested guidelines only
and may require ground plane modifications for electrical and/or thermal considerations. When an increase in
ground plane size is necessary, solder mask over bare copper (SMOBC) should be utilized to contain solder and
eliminate alignment problems during solder reflow. Electrical and/or thermal considerations may also require the
board to contain plated vias located under the surface mount package. When this is necessary, the
recommended via diameter is 0.3mm with a pitch of 1.0mm. To prevent solder wicking inside the via during
reflow, solder mask pads are recommended over all vias located under the package. The solder mask diameter
should be 100 microns larger than the via diameter. Blind or filled vias also work well as an alternative to solder
mask to further enhance thermal conduction.
Package Style Footprints
1
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and/or prototype measurements. Commitment to develop is not guaranteed.
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Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.