C2084 Datasheet, PDF (1/3 Pages) M/A-COM Technology Solutions, Inc. – Ceramic Surface Mount Amplifier

Application Note
C2084
Ceramic Surface Mount Amplifier
1. Introduction
M/A-COM’s Ceramic Surface Mount amplifier
platform offers superior intermodulation
performance for IF amplifiers in a commercial LGA
(Land Grid Array) package. This design approach
integrates coupler feedback transformer technology
into a low cost package with excellent thermal
performance. The amplifiers in this family can be
used individually or cascaded in pairs to achieve
any gain between 10 and 30 dB in 5 dB steps.
Desired
Gain (dB)
10
Stage 1
Amplifier
AM05-0006
Stage 2
Amplifier
N/A
Prototype
Amplifier
AM05-0006-TB
15
AM05-0005
N/A
AM05-0005-TB
20
AM05-0006 AM05-0006
N/A
25
AM05-0005 AM05-0006
N/A
30
AM05-0005 AM05-0005
N/A
Table 1. Selection Guide for 10 to 30 dB
Gain
2. Product Selection and Prototype
Boards
For gains of 10 or 15 dB an individual AM05-0006
or AM05-0005 amplifier would be used. For gains
of 20, 25, and 30 dB two amplifiers would be
cascaded per Table 1. Note that for the 25 dB gain
cascade, it is desirable to put AM05-0005 first,
since noise figure is lower when the higher gain
amplifier is the first element of the cascade.
Prototype boards are available for the AM05-0005
and AM05-0006 amplifiers. These boards are
connectorized so the the customer can easier
evaluate prototype quantities, without needing to
develop prototype boards. DC voltage and return
wires can be soldered or clipped to the DC
connectors. The part numbers for the prototype
boards are AM05-0005-TB and AM06-0006-TB.
See Figure 1 for a prototype board with the AM05-
0006 amplifier mounted to it.
Rev. V3
Figure 1. Prototype Board AM05-0006-TB
3. Package Design
The base of the package is ceramic due to the
power dissipated in the transistor. Using a ceramic
package is the best way to transfer heat out of the
transistor, and still keep the design low cost for the
commercial market. A land grid array package was
used so that the amplifiers can easily be soldered
to the end user’s printed circuit board. There are
two RF connections (RF IN and RF OUT) and a
bias connection. All of the other connections are
ground. The grounds are kept small to minimize
mechanical stress on the solder joints as the
temperature changes, due to the thermal
expansion and contraction of the ceramic. Some of
the grounds are actually used for thermal transfer,
as opposed to just providing an RF ground. The
leads are pretinned with solder to enhance
soldering by the customer. See Figure 2 for a top
and bottom view of the package.
1
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