AN4004 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – Mounting Instructions for the MA4PK2001 & MA4PK3001 High Power PIN Diodes

AN4004
Mounting Instructions for the MA4PK2001 & MA4PK3001
High Power PIN Diodes
Rev. V1
Mounting
These devices were designed to be typically used
in a shunt configuration with the cathode contact
screw mounted to a good thermal/electrical ground.
The cathode on the MA4PK2001 is fitted with a
6-40 UNF-3A screw lug. The cathode on the
MA4PK3001 is fitted with a 10-32 UNF-2A screw
lug. Each device has been designed with either a
spline or slotted hole in the ground lug for the use
of torque tools for mounting. The maximum torque
is not to exceed 56 in-ounces for the MA4PK2001
and 80 in-ounces for the MA4PK3001. Thermally
and electrically conductive paste can be used
during the mounting of the device for improve
contact but is not necessary.
The anode contact as previously mentioned is
typically achieved via wrap-around wire assembly.
The wire size and construction is typically dictated
by the frequency of operation and current through
the device and should not exceed maximum
ratings. Figure 1 shows a typical assembly.
The following application note denotes typical
mounting of the MA4PK2001 & MA4PK3001
devices. The mounting of these devices are not
limited to the configuration described herein and is
published only as a reference and a guide.
Package Construction and Overview
The metal-ceramic packages were developed
specifically for the Kilovolt PIN diode series. The
packages are designed to withstand extremely high
voltages and currents and to be compatible with
industry standard semiconductor chip and RF
circuitry. These packages meet the environmental
requirements of MIL-STD-202 and MIL-STD750.
The PIN diode chip is bonded to the package and
the anode strap is bonded to the chip at
temperatures exceeding 300°C. The anode strap
has a unique, large cross-sectional area design
allowing for high current capability. The packages
are sealed using a projection welding technique in
an inert environment. Kilovolt PIN diodes are
available with a solder lug on the anode electrode
to allow for a convenient and reliable Wrap-around
wire connection.
General Soldering Precautions
The melting temperature of solder generally
exceeds the recommended maximum operating
temperature of the device. When the entire device
is heated to a high temperature, failure to complete
soldering within a short time could result in device
failure. Therefore, always observe the following
instructions to minimize the thermal stress to the
devices.
• Always preheat the device (failure to do so can
cause excessive thermal shock and stress that
can result in damage to the device).
• Limit the temperature in the reflow stage to peak
temperature indicated in the following table
(Figure 2).
• After completing the soldering process, allow the
devices to cool naturally for at least 3 minutes.
(Gradual cooling should be used, as the use of
forced cooling will increase the temperature
gradient and may result in latent failure due to
mechanical stress).
• Avoid any mechanical stress or shock to the
solder joints and devices during cooling.
1
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typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
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