AN3018 Datasheet, PDF (1/2 Pages) M/A-COM Technology Solutions, Inc. – Known Good Die Delivery Specification

Application Note
AN3018
Known Good Die Delivery Specification
Rev. V2
Scope
Visual Inspection
This application note describes M/A-COM’s standard
Known Good Die (KGD) delivery practices for use in
high volume commercial applications. All KGD are
electrically tested, visually inspected, and delivered
in wafer form. Consult the factory if your application
requires special test, inspection, screening, or
packaging.
Electrical Test
All die will be inspected using an automated vision
system. Die will be compliant with MIL-STD-883,
Method 2010, Class B criteria.
Packaging
Die will be delivered on wafer tape per Table 1. Unit
of measure is die. Quantity per shipping container
will vary.
All die are functionally tested to the product test
plan.
Table 1: Packaging
Packaging Material Wafer
Diameter
Wafer Tape
4 inch
Part Number
Semiconductor Equip. Corp.
18733-10.4
Notes
Standard Blue Tape
Not UV sensitive, Figure 1
Grip Ring Carrier
4 inch
Perfection Products
GRP-2620-5
Inside Diameter: 6.689”
Outside Diameter: 7.322”
Thickness: 0.236”, Figure 1
Grip Ring Shipper
4 inch
Perfection Products GRS-
3970-5b
Mechanical and ESD Protection
Figure 2
Labeling
Carrier and shipper will be marked per Table 2.
Barcode format is code 39 using data identifiers
per Table 3.
Table 2: Labeling
Mark
Location
Carrier
Attribute
M/A-COM
Wafer ID
Human Barcode
Readable
X
X
Shipper M/A-COM
X
M/A-Com
X
X
Part Number
Lot Number
X
X
Figure 1: Carrier & Label
Quantity
X
X
Date
X
Date Code
X
Country of
X
Origin
ESD Warning
X
1
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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