AN-010 Datasheet, PDF (1/2 Pages) M/A-COM Technology Solutions, Inc. – Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components

AN-010
Reflow Soldering Guidelines for RoHS* Compliant
E-Series Surface Mount Components
Rev. B
Introduction
This application note describes recommended prac-
tices and guidelines for the successful
assembly of M/A-COM Technology Solutions E-
Series surface mount components using automated
solder reflow techniques. Incorrect handling, stor-
age, reflow and cleaning may damage the compo-
nents.
Handling and Storage Precautions
Most E-series components are static sensitive and
are packaged accordingly. Appropriate handling pre-
cautions should be observed. The typical shelf life of
these components is 24 months. However, corro-
sive, salty or high humidity atmospheres can have
an adverse affect on the solderability of
contact pads/pins. Manual handling of the
components is not recommended.
Solder Pad Layout
Each E-series surface mount data sheet
recommends a solder pad layout based on IPC
standards. Deviation from these recommended
layouts can adversely effect the solder joint strength
and integrity.
Component Construction
All M/A-COM Technology Solutions E-series compo-
nents are designed to withstand solder reflow condi-
tions, as recommended in this application note. The
table below details the construction of our most popu-
lar surface mount components.
Component Construction
Substrate Type
Plating Construction
Cover Material (where applicable)
Ceramic Leadless
Electroless Nickel Immersion Gold High temperature polymer mould
(ENIG)
High temperature 6/6 nylon disk
DAP
SOT
Sn over Copper
FR-4
Leadless
ENIG
High temperature polymer mould
High temperature 6/6 nylon disk
Galvanised steel
Solder Paste
M/A-COM Technology Solutions E-series compo-
nents are designed to work with most recom-
mended reflow profiles for the SAC305/SAC405
type solders, and are fully compatible with the stan-
dard reflow profiles used for the SN60, SN62 and
SN63 solder pastes, including no-clean pastes.
For most case styles, a paste thickness of 0.25mm
± 0.05mm will provide an adequate
solder joint. For the SM-22 case style, a solder
paste thickness of 0.20mm ± 0.025mm is
recommended.
Component Placement
E-Series components are designed for placement
using automatic Pick and Place equipment.
Component placement is critical to negate shorts
caused by solder bridging. Most E-series
components can accept a side overhang of up to 50%
of the pad width, and a toe overhang of up to 10% of
pad length.
For the SM-22 case style, side overhang must be less
than 25%, and toe overhang less than 5%.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
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M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.