28333-PCN-001-A_15 Datasheet, PDF (1/2 Pages) M/A-COM Technology Solutions, Inc. – Customer Notification

March 19, 2002
CN 031902
Customer Notification
Mold Compound and Die Attach Change for ETQFP Package
DS3/E3/STS-1 LIU Framer
Dear Valued Customer:
This notification is for the purpose of informing you of a change by Conexant Systems/MINDSPEED
Technologies in the package mold compound and die attach material used for the CX2833x-18 and
M2833x-34 devices. Details of this change are described below.
Purpose
To utilize the standard mold compound and die attach material as recommended by our assembly
subcontractor, Amkor, in the production of ETQFP packages. The change is as follows:
Mold compound
Die attach
Original
Sumitomo 7351UL
Ablestik 8361J
New
Sumitomo G700
Ablestik 3230
Change Schedule
Customers should expect to receive products with the new mold compound and die attach in late Q2,
CY02.
Method to identify parts
The products with the new mold compound will be identifiable by date code. This information will be
available upon request.
Customer Impact
There are no changes to performance of the device. The new mold compound and die attach have been
qualified by Mindspeed Technologies. Qualification information is available upon request.
We are confident this change will allow Conexant Systems/MINDSPEED Technologies to maintain its
high standards for quality and reliability. We will be managing this change very closely to ensure
minimum disruption to our customers. If, at any time, you have a need for further information, please
contact your local Sales Representative.
Rev. 12/98
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