02013-DSH-001-G Datasheet, PDF (1/20 Pages) M/A-COM Technology Solutions, Inc. – CMOS Transimpedance Amplifier with AGC for Fiber-optic Networks up to 3.2 Gbps

M02013
CMOS Transimpedance Amplifier with AGC for Fiber-optic
Networks up to 3.2 Gbps
The M02013 is a transimpedance amplifier (TIA) with AGC manufactured in a sub-micron, CMOS process. The
AGC allows more than 25 dB of dynamic range, providing a low-cost solution for longer-reach 3.2 Gbps ATM/
SONET systems.
For optimum system performance, the M02013 die should be mounted with a silicon or InGaAs PIN photodetector
inside a lensed TO-Can or other optical sub-assembly.
The M02013 can either bias the PIN diode from the internal regulator or use an externally biased PIN diode.
A replica of the average photodiode current is available at the MON pad for photo-alignment and Receive Power
monitoring (SFF-8472 compliant).
Applications
• ATM/SDH/SONET
• 2x/4x Fiber Channel
Features
• Typical -23 dBm sensitivity, +3 dBm saturation at
3.2 Gbps (-24 dBm at 2.5 Gbps) when used with
0.9 A/W InGaAs PIN. (Cpd ≤ 0.5 pF BER 10^-10)
• Typical differential transimpedance: 10 kΩ
• Fabricated in standard CMOS
• Differential output
• Operates with standard +3.3 Volt supply
• Available as die only
• Monitor Output
• AGC provides dynamic range of more than 25 dB
• Internal or external bias for photodiode
• PIN or APD sensor
• Same pad layout and die size as M02011/14/15/16
Typical Applications Diagram
V_CC
Rm
02013-DSH-001-G
1 nF
V_CC
PINK
MON
DOUT
AC-Coupled
to Limiting
Amplifier
470 pF _M02013
Limiting
Amplifier
PINA
GND
DOUTB
TIA Bond Pad
TO Can Lead
Mindspeed Technologies^®
Mindspeed Proprietary and Confidential
October 2007