LWH1030 Datasheet, PDF (6/13 Pages) –

6. 材料
item
LED chip
wire
lead frame
encapsulation
heat-resistant polymer
material
InGaN
gold
copper alloy/Ni/Ag plating
Silicone resin + phosphor
PPA
7. 包装材料
7.1. テープ(material : PS conductive)
(Unit: mm)
(Ver 1.0)
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