LFH1056 Datasheet, PDF (6/17 Pages) LUXPIA – Specification for Approval

5. Materials
item
LED chip
wire
lead frame
encapsulation
heat-resistant polymer
material
InGaN, AlInGap
gold
copper alloy/Ni/Ag plating
Epoxy Resin or Silicone Resin
PPA


6. Taping
6.1. tape (material : PS conductive, 10⁴~10⁵Ω)
(units : mm)






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