LOH1006 Datasheet, PDF (5/12 Pages) –

5. 材料
item
LED chip
Wire
Lead Frame
Encapsulation
material
AlGaInP
Gold
BT-resin (Cu/Ni/Au plating)
Epoxy + Silicone resin
6. 包装材料
6.1. テープ
(Unit: mm)
(Ver 1.0)
4/11