LRH1035_13 Datasheet, PDF (12/16 Pages) LUXPIA – Specification for Approval

• Printed Circuit Board Assembled (PCB with LEDs soldered)
Do not stack assembled PCBs together. Since silicone is a soft material abrasion between two PCB assembled
with encapsulate LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as
scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment.
(6) Soldering Conditions
• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any
guarantee on the LEDs after they have been assembled using the dip soldering method.
• Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-Heat
Pre-Heat Time
Peak Temperature
Soldering Time
Condition
120~150
120sec Max.
240 Max.
10sec Max.
refer to profile ˝
180~200
120sec Max.
260 Max.
10sec Max.
refer to profile ˞
Temperature
Soldering Time
350 Max.
3sec Max.
(one time only)
* Although the recommended soldering conditions are specified in the above table, reflow soldering at the
lowest possible temperature is desirable for the LEDs.
* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-Profile (surface of circuit board)]
Use the conditions shown to the following figures.
<˝ : Lead Solder>
<˞ : Lead-free Solder>










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