LIH1006 Datasheet, PDF (11/14 Pages) LUXPIA – Specification for Approval

(6) Soldering Conditions
• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any
guarantee on the LEDs after they have been assembled using the dip soldering method.
• Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-Heat
Pre-Heat Time
Peak Temperature
Soldering Time
Condition
120~150
120sec Max.
240 Max.
10sec Max.
refer to profile ˝
180~200
120sec Max.
260 Max.
10sec Max.
refer to profile ˞
Temperature
Soldering Time
350 Max.
3sec Max.
(one time only)
* Although the recommended soldering conditions are specified in the above table, reflow soldering at the
lowest possible temperature is desirable for the LEDs.
* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-Profile (surface of circuit board)]
Use the conditions shown to the following figures.
<˝ : Lead Solder>
<˞ : Lead-free Solder>




• Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during
air reflow. It is recommended that the User use the nitrogen reflow method.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-
head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the
LEDs will or will not be damaged by repairing.






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