DS47 Datasheet, PDF (7/13 Pages) Lumileds Lighting Company – power light source LUXEON® Warm White Emitter and Star

Electrical Characteristics at 350mA, Junction Temperature, T_J = 25ºC,
Continued
Table 7.
Part Number
Forward Voltage V_F ^[1]
(V)
Min. Typ. Max.
Dynamic
Resistance ^[2]
(Ω) R_D
Temperature Coefficient
of Forward Voltage ^[3]
(mV/ºC)
ΔV_F / ΔT_J
Thermal Resistance,
Junction to Case
(ºC/W) Rθ_{J B}
LXHL MWGC
2.79 3.42 3.99
1.0
2.0
20
LXHL NWG8
2.79 3.42 3.99
1.0
2.0
20
Notes for Table 7:
1. Philips Lumileds maintains a tolerance of ± 0.06V on forward voltage measurements.
2. Dynamic resistance is the inverse of the slope in linear forward voltage model for LEDs. See Figures 3a and 3b.
3. Measured between 25°C ≤ T_J ≤ 110°C at I_F = 350mA.
Absolute Maximum Ratings Emitter
Table 8.
Parameter
LXHL BW03
DC Forward Current (mA) ^[1]
350
Peak Pulsed Forward Current (mA)
500
Average Forward Current (mA)
350
ESD Sensitivity ^[2]
± 16,000V HBM
LED Junction Temperature (°C)
120
Storage Temperature (°C)
40 to +120
Soldering Temperature (°C) ^[3]
260 for 5 seconds max
Absolute Maximum Ratings Star Products
Table 9.
Parameter
LXHL MWGC
LXHL NWG8
DC Forward Current (mA) ^[1]
350
350
Peak Pulsed Forward Current (mA)
500
500
Average Forward Current (mA)
350
350
ESD Sensitivity ^[2]
± 16,000V HBM
± 16,000V HBM
LED Junction Temperature (°C)
120
120
AluminumCore PCB Temperature (°C) ^[4]
105
105
Storage & Operating Temperature (°C) ^[5]
40 to +105
40 to +75
Notes for Tables 8 & 9:
1. Proper current derating must be observed to maintain junction temperature below the maximum. For more information,
consult the LUXEON Design Guide, available upon request.
2. LEDs are not designed to be driven in reverse bias. Please consult Philips Lumileds application brief AB11 for
further information.
3. Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120°C. LUXEON emitters
cannot be soldered by general IR or Vaporphase reflow, nor by wave soldering. Lead soldering is limited to selective
heating of the leads, such as by hotbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may
not be attached by soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and
the board is required. Please consult Philips Lumileds Application Brief AB10 on LUXEON Emitter Assembly Information for
further details on assembly methods.
4. Allowable MCPCB temperature to avoid exceeding maximum junction temperature at maximum V_f limit based on thermal
resistance of Star assembly.
5. A reduction in maximum storage and operating temperature is required due to the acrylic optic.
LUXEON Warm White Emitter & Star DS47 (7/06)
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