MXL8-PW27-0000 Datasheet, PDF (6/26 Pages) Lumileds Lighting Company – LUXEON 5630 Mid-Power LEDs

Reflow Soldering Characteristics
300
Tp: 255°C
250
Tc: 240°C
Maximum Reflow Profile
Recommended Reflow Profile
Minimum Reflow Profile
TL: 217°C
200
Tsmax: 200°C
Tsmin: 150°C
150
100
120 seconds, max.
260°C +0/-5°C
245°C 5°C
235°C +5/-0°C
10sec., min.
30 seconds, max.
100 seconds, max
50
0
0
50
100
150
200
250
300
Time (seconds)
Temperature Profile for Table 6.
Table 6. Reflow Profile in Accordance with J-Std-020b.
Profile Feature
Preheat/Soak :
Temperature Min (T_smin )
Temperature Max (T_smax )
Maximum Time (t_s ) from T_smin to T_smax
Ramp-up Rate (T_L to T_p )
Liquidous Temperature (T_L )
Maximum Time (t_L ) Maintained above T_L
Maximum Peak Package Body Temperature (T_p )
Time (t_p ) within 5°C of the specified temperature (T_c )
Maximum Ramp-Down Rate (T_p to T_L )
Maximum Time 25°C to Peak Temperature
Lead Free Assembly
150°C
200°C
120 seconds
3°C / second
217°C
100 seconds
260°C
30 seconds
6°C / second
8 minutes
Note for Table 6:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Lumileds 5630 Datasheet DS201 20130228 ©2013 Philips Lumileds Lighting Company.
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