LHDF-RB10300000000 Datasheet, PDF (1/12 Pages) Lumileds Lighting Company – Chip Scale Package LED

LUXEON Flip Chip
Chip Scale Package LED
Introduction
Philips Lumileds LUXEON^® Flip Chip LED Technology enables the next generation of lighting applications.
Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level
and customize the phosphor and packaging to best suit their lighting applications.
LUXEON Flip Chip is a real Chip Scale Package LED that can be attached by reflow without additional packaging.
Traditional wire bonding limits the packing and power density of LEDs. LUXEON Flip Chip LEDs can be packaged
closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen
output at higher lumen densities.
This document contains the performance data needed to design and engineer Philips Lumileds LUXEON Flip Chip
based application.
Features
• High drive current up to 1A/mm²
• 1.0 mm x 1.0 mm 5-sided emitter
• 440-460 nm wave length
• Low typical forward voltage of 2.9V
• Low thermal resistance
• Symmetric, large bond pads bumped
with AuSn solder
Benefits
• High current density for high
lumen and lm/$ at high lm/W
• High-packaging density
• 5-sided emitter for dispense and
remote phosphor applications
• Surface mount capable
• No wire bonds
• Robust design with proven
Lumileds reliability
Key Applications
• High-power LED emitters
• Chip on board applications
• Remote phosphor applications
LUXEON Flip Chip DS116 ©2013 Philips Lumileds Lighting Company.