SMD33.8688M Datasheet, PDF (3/5 Pages) Shenzhen Luguang Electronic Technology Co., Ltd – CRYSTAL UNITS

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l RELIABILITY SPECIFICATIONS
No.
Test Item
High Temperature
1
Storage
2 Temperature Cycle
Solder Heat
3
Resistance
4 Drop Test
High Temperature,
5 High Humidity
Storage
6 Steam Aging
7 Solderability
8 Aging
9 Thermal Shock
10 Vibration
Test Conditions
Temperature: 125℃±10℃
Time:
1000±24 Hours
Temperature 1: -55℃±10℃
Temperature 2: 125℃±10℃
Temperature change between T1 and T2 at
soonest
Run 10 cycles, maintain T1 and T2
30minutes each in one cycle
Pre-heat: 125℃ 60~120 Seconds
Solder Temperature: 260℃±10℃
Time:
5 Seconds
3 Times Free Fall from 75cm height table to
3cm thickness hard wood board
Temperature: 85℃
Relative Humidity: 85%
Time: 1000 Hours
Temperature: 97℃
Time:
8 Hours
230℃ solder pot to check solderability
Dip in flux 5~10 seconds
Temperature: 230℃±10℃
Time:
5 Seconds
Temperature: 85℃
Time:
300 Hours
Temperature 1: -55℃±10℃
Temperature 2: 125℃±10℃
Temperature change between T1 and T2:
5 seconds
10 cycles, maintain T1 and T2 for 30
minutes each in one cycle
Frequency Range: 10Hz~1000Hz
Amplitude:
1.5mm
40mins in each direction, total 120mins
Reference
MIL-STD-883E
MIL-STD-883E
MIL-STD-202F
MIL-STD-202F
MIL-STD-883E
MIL-STD-883E
MIL-STD-883E
MIL-STD-883E
MIL-STD-202F
MIL-STD-883E
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
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