AK6-058C Datasheet, PDF (2/2 Pages) Shenzhen Luguang Electronic Technology Co., Ltd – Transient Voltage Suppression Diodes

AK6 Series
Transient Voltage Suppression Diodes
Soldering Parameters
Reflow Condition
Lead–free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Time (min to max) (t_s)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
280°C
T_P
T_L
T_s(max)
T_s(min)
25˚C
Ramp-up
t_p
t_L
Critical Zone
T_L to T_P
t_s
Preheat
Ramp-down
t 25˚C to Peak
Time (t)
Flow/Wave Soldering (Solder Dipping)
Peak Temperature :
Dipping Time :
Soldering :
265^OC
10 seconds
1 time
Physical Specifications
Weight
Contact manufacturer
Case
Epoxy encapsulated
Terminal
Silver plated leads, solderable per
MIL-STD-202 Method 208
Ratings and Characteristic Curves (T_A=25°C unless otherwise noted)
Peak Power Derating
120
100
80
60
40
20
0
0
25
50
75
100
125
150
AM BIENT TEM PERATURE (°C)
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