US1AB Datasheet, PDF (1/2 Pages) Shanghai Sunrise Electronics – SURFACE MOUNT ULTRA FAST SWITCHING RECTIFIER

US1AB-US1MB
Surface Mount Rectifiers
REVERSE VOLTAGE: 50 - 1000 V
FORWARD CURRENT: 1.0 A
Features
Plastic package has underwriters laboratories
vvv _{vvflam mability classification 94V-0}
For surface mount applications
Glass passivated chip junctions
Low profile package
Eas y pick and place
Ultrafas t recovery tim es for high efficiency
Low forward voltage,low power loss
Built-in strain relief,ideal for autom ated placem ent
High temperature soldering:
111 ₂₅₀^oC/10 seconds on terminals
Mechanical Data
Cas e:JEDEC SMB,m olded plas tic body over
passivated chip
Polarity: Color band denotes cathode end
Weight: 0.003 ounces, 0.093 gram
SMB
4.7± 0.25
5.4± 0.2
1.3± 0.2
0.2± 0.05
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25^oC ambient tem perature unless otherwise specified
Device marking code
US1AB US1BB US1DB US1GB US1JB US1KB US1MB UNITS
Maximum repetitive peak reverse voltage
V_RRM
50
Maximum RMS voltage
V_RWS
35
Maximum DC blocking voltage
V_DC
50
Maximum average forw ard rectified current at
T_L=110^OC
Peak forw ard surge current 8.3ms single half-
sine-w ave superimposed on rated load(JEDEC
Method)
I_F(AV)
I_FSM
Maximum instantaneous f orward voltage at1.0A V_F
Maximum DC reverse current @T_A=25^oC
at rated DC blockjing voltage
@T_A=125^oC
Maximum reverse recovery time at I_F=0.5A
I_R=1.0A I_rr=0.25A
Typical junction capacitance at 4.0V,1MH_Z
Maximum thermal resistance (NOTE1)
Operating temperature range
I_R
t_rr
C_J
R _JA
R _JL
T_J
Storage temperature range
T_STG
NOTE: 1.P.C.B.mounted on 0.2X0.2"(5.0X5.0mm) copper pad area
100
200 400 600 800 1000
V
70
140 280 420 560 700
V
100
200 400 600 800 1000
V
1.0
A
30.0
A
1.0
1.7
5.0
100.0
50
75
20
15
55
20
-55------- +150
-55------- +150
V
ns
pF
o_C/W
o_C
o_C
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