RGL1A Datasheet, PDF (1/2 Pages) Diotec Semiconductor – Fast Switching Surface Mount Si-Rectifiers

RGL1A-RGL1M
Surface Mount Rectifiers
VOLTAGE RANGE: 50 --- 1000 V
CURRENT: 1.0 A
Features
Plastic package has underwriters laboratories
flammability classification 94V-0
Glass passivated chip junction
For surface mount applications
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
High temperature soldering guaranteed:450 /5 seconds
at terminals.Complete device sub-mersible temperature
of 265 for 10 seconds in solder bath
Mechanical Data
Case: JEDEC DO-213AA,molded plastic
Polarity: Color band denotes cathode
Weight: 0.0014 ounces, 0.036 grams
Mounting position: Any
DO - 213AA
SOLDERABLE ENDS
D2=D1
Đ0
Ē0.20
D2
0.5± 0.1
3.5± 0.2
0.5± 0.1
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%.
RGL RGL RGL RGL RGL
1A 1B 1D 1G 1J
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
V_RRM
V_RMS
V_DC
50 100 200 400 600
35 70 140 280 420
50 100 200 400 600
Maximum average forward rectified current
T_T=75
I_(AV)
1.0
Peak forward surge current
8.3ms single half-sine-wave
I_FSM
25
superimposed on rated load (JEDEC Method)
RGL
1K
800
560
800
RGL
1M
1000
700
1000
UNITS
V
V
V
A
A
Maximum instantaneous forward voltage @1.0A
V_F
1.3
V
Maximum reverse current
@T_A=25
at rated DC blocking voltage @T_A=125
Maximum reverse recovery time (Note 1)
Typical thermal resistance (Note 3)
Operating junction temperature range
I_R
t_rr
R_θJA
T_j
5.0
µA
50
150
250
500
ns
150
/W
- 55 ---- +175
Storage temperature range
T_STG
- 55 ---- +175
NOTE: 1. Measured with I_F=0.5A,I_R=1.0A,I_rr=0.25A
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Thermal resistance from junction to ambient, 0.24×0.24"(6.0×6.0mm) copper pads to each terminal.
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