DBL0.3J Datasheet, PDF (1/2 Pages) Shenzhen Luguang Electronic Technology Co., Ltd – Surface Mount Diode

DBL0.3J~DBL0.3M
Surface Mount Diode
Features
● Low profile space
● Ideal for automated placement
● Glass passivated chip junctions
● Low leakage current
● High forward surge capability
● _{High temperature soldering：}
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
● _{Case: JEDEC SOD-123FL molded plastic}
body over glass passivated chip
● _{Terminals: Solder plated, solderable per}
J-STD-002B and JESD22-B102D
● _{Polarity: Laser band denotes cathode end}
● _{Weight: 0.017gram}
SOD-123FL
Cathode Band
Top View
2.80.1
0.60.25
3.70.2
Dimensions in millimeters
Maximum Ratings & Thermal Characteristics
(T_A = 25 °C unless otherwise noted)
Items
Symbol
DBL0.3J
Maximum repetitive peak reverse voltage
V_RRM
600
Maximum RMS voltage
V_RMS
420
Maximum DC blocking voltage
V_DC
600
Maximum average forward rectified current
I_F(AV)
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
I_FSM
Thermal resistance from junction to ambient ⁽¹⁾
R_θJA
Operating junction and storage temperature range T_J, T_STG
Note 1: Mounted on P.C.B. with 0.036 x 0.06” (0.9 x 1.5mm) copper pad areas.
DBL0.3K
800
560
800
0.3
15
220
–55 to +150
DBL0.3M
1000
700
1000
UNIT
V
V
V
A
A
℃/ W
℃
Electrical Characteristics ^(TA ^{= 25 °C unless otherwise noted)}
Items
Test conditions
Symbol
Min
Instantaneous forward voltage
Reverse current
I_F=0.3A⁽²⁾
V_F
-
V_R=V_DC
T_A=25℃
T_A=100℃
I_R
-
Note2: Pulse test:300μs pulse width,1% duty cycle.
Type
0.95
-
Max UNIT
1.10
V
2
μA
50
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