BZG04-8V2 Datasheet, PDF (1/3 Pages) Shenzhen Luguang Electronic Technology Co., Ltd – Transient Voltage Suppressor

BZG04 Series
Transient Voltage Suppressor
BREAKDOWN VOLTAGE: 8.2 --- 220 V
PEAK PULSE POWER: 300 W
Features
Plastic package has underwriters laboratory
flammability classification 94V-0
Optimized for LAN protection applications
Low profile package with built-in strain relief for
surface mounted applications
Glass passivated junction
Low incremental surge resistance, excellent clamping
capability
300W peak pulse power capability with a 10/1000µs wave-
form, repetition rate (duty cycle): 0.01%
Very fast response time
High temperature soldering guaranteed: 250°C/10
seconds at terminals
Mechanical Data
DO-214AC(SMA)
4.5± 0.1
5.1± 0.2
1.3± 0.2
0.2± 0.05
Case:JEDEC DO-214AC molded plastic over passivated
chip
Terminals: solder plated, solderable per MIL-STD-750,
method 2026
Mounting position: any Weight: 0.002 ounces, 0.064 grams
Dimensions in millimeters
Devices for Bidirectional Applications
For bi-directional devices, use suffix C (e.g. BZG04-10C). Electrical characteristics apply in both directions.
MAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
SYMBOL
VALUE
Non-repetitive peak reverse power dissipation 10/1000s
exponential pulse(see Fig.3); Tj=25prior tosurge; see also Fig.1
Typical thermal resistance, junction to ambient
PRSM
RθJA
300
100(NOTE1)
150(NOTE2)
UNIT
W
/W
Forward voltage @IF=0.5A; seeFig.2
VF
1.2
V
Operating junction temperature range
RθJL
-55---+175
Operating storage temperature range
TJ
-55---+175
NOTES: (1) Device mounted on an Al₂O₃ printed-circuit board, 0.7mm thick; thickness of Cu-layer 35m, see Fig.4.
(2) Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer40m, see Fig.4.
For more information please refer to the "General Part of associated Handbook".
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