UT6 Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – High heat pump density

Innovative Technology
for a Connected World
UltraTEC^TM Series UT6,24,F1,5555
Thermoelectric Module
The UltraTEC^TM Series is a high heat pumping density thermoelectric module (TEM). The module is
assembled with a large number of semiconductor couples to achieve a higher heat pumping capacity
than standard single stage TEMs.
This product line is available in multiple configurations and is ideal for applications that require higher
cooling capacities with limited surface area. Assembled with Bismuth Telluride semiconductor material
and thermally conductive Aluminum Oxide ceramics, the UltraTEC^TM Series is designed for higher
current and larger heat-pumping applications.
FEATURES
• High heat pump density
• Precise temperature control
• Reliable solid state operation
• No sound or vibration
• DC operation
• RoHS compliant
APPLICATIONS
• Analytical instrumentation
• Clinical diagnostics
• Photonics laser systems
• Electronic enclosure cooling
• Food and beverage cooling
• Chillers (liquid cooling)
PERFORMANCE SPECIFICATIONS
Hot side temperature (°C)
25
Qmax (watts)
113
Delta Tmax (°C)
74
Imax (amps)
6.0
Vmax (volts)
29.8
SUFFIX
THICKNESS
TA
0.154” +/- 0.001”
3.90 +/- 0.02 mm
FLATNESS &
PARALLELISM
0.0008” / 0.0016”
0.02 mm / 0.04 mm
HOT
FACE
Lapped
Lapped
COLD
FACE
Lapped
Lapped
LEAD
LENGTH
6.0”
152.4 mm
SEALING OPTION
SUFFIX SEALANT COLOR
RT
RTV
White
EP
Epoxy
Black
TEMP RANGE
-60 to 204 °C
-55 to 150 °C
DESCRIPTION
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
global solutions: local support TM
Americas: +1 888.246.9050
Europe: +46.31.704.67.57
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com