SS-HTD03 Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – High temperature applications

Tlam™ SS HTD03
Thermally Conductive PCB Substrate
(High Temperature)
THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARD SUBSTRATE
Tlam SS HTD03 is a high temperature thermally conductive PCB substrate. The construction consists of a
copper circuit layer bonded to an aluminum or copper base plate with 150°C rated Tlam PP HTD03 dielectric.
The technology of Tlam system resides in the Tlam HTD03 dielectric which offers excellent thermal resistance
and high temperature durability.
Tlam SS HTD03 laminate is processed through standard FR4 print and etch operations.
Tlam SS HTD03 has 6~8 times better thermal conductivity than FR4 to keeping components cool. The Tlam SS
HTD03 laminate is processed through standard FR4 print and etch operations and run through standard pick
and place SMT and manual wire bond process.
Standard constructions are made with 1 and 2 ounce copper and 0.040 (1mm) and 0.062 (1.6mm) inch thick
aluminum. Custom construction of heavier weight circuit copper and thicker aluminum and copper base plate
are also available.
FEATURES AND BENEFITS
 Very low thermal resistance of 0.049°C-in²/W
 Cost effective solution which allow simplified
designs and smaller devices
 High temperature applications
 High glass transition temp for lead free solder
compatibility
 UL 746 B RIT of 150℃
 RoHS compliant
 Environmentally green
MARKETS
 Automotive headlamp
 LED applications
 Power supplies – AD/DC and DC/DC
 Motor drives
USA: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755 2714.1166
[e-mail]
www.lairdtech.com
THR-DS-Tlam-SS HTD03 1115
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