SS-HTD Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – RoHS compliant

Innovative Technology
for a Connected World
Tlam^TM SS HTD
Thermally Conductive PCB Substrate
THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARD SUBSTRATE
Tlam SS HTD is a thermally conductive PCB substrate. The construction consists of a copper circuit layer
bonded to an aluminum or copper base plate with 150 C rated Tlam HTD dielectric. Tlam SS HTD laminate
is processed through standard FR4 print and etch operations.
Tlam SS HTD products have 6-8 times better thermal conductivity than FR4--key to keeping components cool.
The Tlam SS HTD boards are run through standard pick and place SMT and manual wire bond processes.
Tlam SS HTD is designed for use in high temperature and/or high-voltage applications typically found in
industrial motor drives and automotive motor controls.
Standard constructions are made with 1 and 2 ounce copper and 0.040 (1mm) and 0.062 (1.6mm) inch thick
aluminum. Custom construction of heavier weight circuit copper and thicker aluminum and copper base
plates are also available.
FEATURES AND BENEFITS
• Lower thermal resistance
• UL^® 746 B RTI of 150°C
• High withstand voltage >6000 VDC
• RoHS compliant
• Environmentally green
• Significantly reduces power device temperature
• Lead free solder compatible
APPLICATIONS
• Automotive -LV under hood and EV motor drives
• 120-480VAC commercial and industrial motor
drives, UPS and welders
• Power Supplies - AC/DC and DC/DC for telecom
and commercial products
global solutions: local support TM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal