SS-1KA Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Lead-free solder compatible

Innovative Technology
for a Connected World
Tlam^TM SS 1KA
Thermally Conductive PCB Substrate
Thermally Conductive Printed Circuit Board Substrate
Tlam SS 1KA^™ is a thermally conductive printed circuit board (PCB) substrate. The substrate consists of a
copper circuit layer bonded to an aluminum or copper base plate with Laird Technologies’ 3 watt/m-K 1KA
dielectric. Tlam SS 1KA^™ materials are processed through standard FR4 print and etch operations.
Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4, and this is the key to keeping
components cool. The Tlam SS 1KA boards run through standard pick and place SMT and manual wire
bond processes.
Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to
thermal cycling. Customers have found that Tlam SS 1KA reduces the stress on solder bonds with
ceramic devices.
Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch
thick aluminum. Custom constructions of heavier weight circuit copper and thicker aluminum and copper
base plates are also available.
FEATURES AND BENEFITS
• UL 746B Electrical/Mechanical RTI as
high as 130°C
• RoHS compliant
• Environmentally green
• Lead-free solder compatible
• Compliant for low bond stress
APPLICATIONS
• Network DC/DC power converters
• Battery powered equipment DC/DC
power converters
• Ultra bright LED substrates
global solutions: local support TM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal